Substrate processing apparatus and method of manufacturing semiconductor device
Substrate processing uniformity is improved in the surfaces of wafers and between the wafers. A method of manufacturing a semiconductor device, including: loading a substrate holder into an inner tube, the substrate holder holding a plurality of substrates in a state where the plurality of substrates are horizontally oriented and stacked; forming thin films on the plurality of substrates by supplying a source gas to an inside of the inner tube; and unloading the substrate holder from the inner tube, wherein the forming the thin films is performed in a state where a conductance of a space between an inner wall of the inner tube and a gas penetration preventing cylinder is smaller than a conductance of a region where the plurality of substrates are stacked.
1. A method of manufacturing a semiconductor device, comprising:
(a) loading a substrate holder into an inner tube, the substrate holder holding a plurality of substrates in a state where the plurality of substrates are horizontally oriented and stacked;
(b) forming thin films on the plurality of substrates by supplying a source gas to an inside of the inner tube; and
(c) unloading the substrate holder from the inner tube,
wherein the step (b) is performed in a state where a conductance of a space between an inner wall of the inner tube and a cylinder disposed under a region where the plurality of substrates are stacked is smaller than a conductance of the region where the plurality of substrates are stacked.
2. A method of claim 1 , wherein the thin films comprise high-k films.
3. A method of manufacturing a semiconductor device, comprising:
(a) loading a substrate holder into an inner tube, the substrate holder holding a plurality of substrates in a state where the plurality of substrates are horizontally oriented and stacked;
(b) forming thin films on the plurality of substrates by supplying a source gas to an inside of the inner tube; and
(c) unloading the substrate holder from the inner tube,
wherein the step (b) is performed in a state where a distance between an outer edge of one of the plurality of substrates accommodated in the inner tube and a gas exhaust outlet is greater than a distance between the outer edge of the one of the plurality of substrates accommodated in the inner tube and a gas injection hole.
4. A method of claim 3 , wherein the thin films comprise high-k films.
5. A method of manufacturing a semiconductor device, comprising:
(a) loading a substrate holder into an inner tube, the substrate holder holding a plurality of substrates in a state where the plurality of substrates are horizontally oriented and stacked;
(b) forming thin films on the plurality of substrates by supplying a source gas to an inside of the inner tube; and
(c) unloading the substrate holder from the inner tube,
wherein the step (b) is performed in a state where a distance between an upper end plate and a top plate of the inner tube is shorter than a distance between a distance between two neighboring substrates of the plurality of substrates.
6. A method of claim 5 , wherein the thin films comprise high-k films.
7. A method of manufacturing a semiconductor device, comprising:
(a) loading a substrate holder into an inner tube, the substrate holder holding a plurality of substrates in a state where the plurality of substrates are horizontally oriented and stacked;
(b) forming thin films on the plurality of substrates by supplying a source gas to an inside of the inner tube; and
(c) unloading the substrate holder from the inner tube,
wherein the step (b) is performed in a state where a conductance of a space between an inner wall of the inner tube and a cylinder disposed under a region where the plurality of substrates are stacked is smaller than a conductance of the region where the plurality of substrates are stacked, and in a state where a distance between an outer edge of one of the plurality of substrates accommodated in the inner tube and a gas exhaust outlet is greater than a distance between the outer edge of the one of the plurality of substrates accommodated in the inner tube and a gas injection hole.