Method of manufacturing semiconductor device using meander-shaped heating element

1. A method of manufacturing a semiconductor device, the method comprising:

loading a substrate into a process chamber surrounded by a heating device including a heating element; and

uniformly increasing a temperature of the heating element including a mountain part and a middle part alternately connected in plurality to form a meander shape with both ends thereof being fixed to an insulating body installed at an outer circumference of the heating element,

wherein the mountain part having a front end inclined in a direction different from a meandering direction of the mountain part and the middle part, and the mountain part and the middle part protruding in a direction perpendicular to a radial direction of the heating element,

wherein the heating element is fixed to the insulating body by a holding body disposed in a holding body receiving part installed at an end of a valley part between two adjacent middle parts, the valley part having a cutout part having a width larger than that of the valley part to heat the substrate in the process chamber, and

wherein the insulating body comprises a storage part accommodating the heating element, and the front end of the mountain part is at a predetermined distance from an upper portion and a lower portion of the storage part.

2. The method of claim 1 ,

wherein the heating element includes: a ring-shaped portion with a pair of power feed parts connected to both ends thereof penetrating and fixed to the insulating body;

wherein the insulating body includes the storage part in an inner circumferential surface of the insulating body, and the storage part includes a ring shape groove to surround an outer circumferential surface of the heating element and to accommodate the ring-shaped portion of the heating element; and

wherein a distance between a bottom surface of the storage part and the ring-shaped portion adjacent to the bottom surface varies in at least one portion of parts respectively constituting entire circumferences of the storage part and the ring shaped portion.

3. The method of claim 2 , wherein, at least when the ring shaped portion is at a room temperature, the distance is set to vary in at least one portion of the parts respectively constituting the entire circumferences of the storage part and the ring shaped portion.

4. The method of claim 2 , wherein, at least when the heating element is at a substrate process temperature, the distance is set to be identical at the parts respectively constituting the entire circumferences of the storage part and the ring-shaped portion by thermal expansion.

5. The method of claim 1 ,

wherein the heating element includes: a ring-shaped portion with a pair of power feed parts connected to both ends thereof penetrating and fixed to the insulating body; and

wherein a width of the holding body receiving part increases as a distance between the holding body receiving part and the both ends increases.

6. The method of claim 1 ,

wherein the heating element includes: a ring-shaped portion with a pair of power feed parts connected to both ends thereof penetrating and fixed to the insulating body; and

wherein a relative position between the holding body receiving part and the holding body varies in at least one portion of parts respectively constituting an entire circumference of the ring shaped portion.

7. The method of claim 1 , wherein the front end of the mountain part is inclined at an obtuse angle.