Patent Assignment
Reel/Frame 022768/0944
Assignment of Assignor's Interest
Recorded: 2009-06-02
Pages: 8
Assignors
LEE, HO JIN
Executed: 2009-05-13
LEE, KANG WOOK
Executed: 2009-05-25
PARK, MYEONG SOON
Executed: 2009-05-13
CHOI, JU IL
Executed: 2009-05-13
HWANG, SON KWAN
Executed: 2009-05-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Integrated Circuit Chips Having Vertically Extended Through-Substrate Vias Therein and Chips Formed Thereby