Patent Assignment
Reel/Frame 022772/0889
Assignment of Assignor's Interest
Recorded: 2009-06-03
Pages: 3
Assignee
IBIDEN CO., LTD.
2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board with Resin Complex Layer and Manufacturing Method Thereof