Patent Assignment
Reel/Frame 022778/0406
Assignment of Assignor's Interest
Recorded: 2009-06-04
Pages: 3
Assignor
LEE, SEUNG-JUN
Executed: 2009-04-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Mold, Manufacturing Method of Mold, Method for Forming Patterns Using Mold, and Display Substrate and Display Device Manufactured by Using Method for Forming Patterns
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.