Assignment of Assignor's Interest

Recorded: 2009-06-04 Pages: 2

Assignor

MORITA, TOMOKI

Executed: 2009-04-23

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Lead Frame, Semiconductor Device, Method for Manufacturing Lead Frame and Method for Manufacturing Semiconductor Device

Application: 12/478,074 →

Publication: US 2009/0309201

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.