Patent Assignment
Reel/Frame 022780/0481
Assignment of Assignor's Interest
Recorded: 2009-06-04
Pages: 4
Assignors
ARAKI, YASUSHI
Executed: 2006-12-16
SATO, SEIJI
Executed: 2006-12-16
NAKAMURA, MASATOSHI
Executed: 2006-12-16
OZAWA, TAKASHI
Executed: 2006-12-16
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Flip-Chip Mounting Substrate and Flip-Chip Mounting Method