IP Library › Assignment 022786/0064
Patent Assignment
Reel/Frame 022786/0064

Assignment of Assignor's Interest

Recorded: 2009-06-05 Pages: 2
Assignors
OOISHI, HAYATO
Executed: 2009-05-28
MATSUKI, KAZUHIKO
Executed: 2009-05-28
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME,, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property (1)
Through-Hole Layout Apparatus That Reduces Differences in Layout Density of Through-Holes
Patent: 8,504,964 →
Application: 12/478,834 →
Publication: US 2009/0307648
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032896/0353 →
Change of Name Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →