IP Library › Assignment 022796/0872
Patent Assignment
Reel/Frame 022796/0872

Assignment of Assignor's Interest

Recorded: 2009-06-08 Pages: 3
Assignors
ERNUR, DIDEM
Executed: 2005-08-19
TERZIEVA, VALENTINA
Executed: 2005-08-19
SCHUHMACHER, JORG
Executed: 2005-08-19
Assignee
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)
75 KAPELDREEF, LEUVEN, 3001, BELGIUM
Covered Property (1)
Slurry Composition and Method for Chemical Mechanical Polishing of Copper Integrated with Tungsten Based Barrier Metals
Patent: 8,080,505 →
Application: 12/480,553 →
Publication: US 2009/0250433
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
"Imec" Is an Alternative Official Name for "Interuniversitair Microelektronica Centrum Vzw" Apr 7, 2010
From: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW
To: IMEC
Reel/Frame 024200/0675 →