Patent Assignment
Reel/Frame 022799/0520
Assignment of Assignor's Interest
Recorded: 2009-06-09
Pages: 2
Assignors
IWASE, TEPPEI
Executed: 2009-04-07
TOMURA, YOSHIHIRO
Executed: 2009-04-07
NOBORI, KAZUHIRO
Executed: 2009-04-07
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
A Semiconductor Device Mounted Structure with an Underfill Sealing-Bonding Resin with Voids