Patent Assignment
Reel/Frame 022809/0185
Assignment of Assignor's Interest
Recorded: 2009-06-10
Pages: 2
Assignor
SEKIYA, KAZUMA
Executed: 2009-05-28
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Treating Method