IP Library › Assignment 022822/0292
Patent Assignment
Reel/Frame 022822/0292

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2009-06-12 Received: 2009-06-12 Pages: 6
Assignors
CAMACHO, ZIGMUND R.
Executed: 2009-04-28
MERILO, DIOSCORO A.
Executed: 2009-04-28
PISIGAN, JAIRUS L.
Executed: 2009-04-28
DAHILIG, FREDERICK R.
Executed: 2009-06-11
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Applications (2)
SEMICONDUCTOR DEVICE AND METHOD OF FORMING VERTICAL INTERCONNECT STRUCTURE BETWEEN NON-LINEAR PORTIONS OF CONDUCTIVE LAYERS
App. No. 12/484,146
→
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CIRCUITRY AND POST, AND METHOD OF MANUFACTURE THEREOF
App. No. 12/473,233
→