Patent Assignment
Reel/Frame 022828/0788
Assignment of Assignor's Interest
Recorded: 2009-06-16
Pages: 3
Assignor
TANAKA, HIRONORI
Executed: 2009-05-26
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Method for Manufacturing Multilayer Printed Wiring Board