Patent Assignment
Reel/Frame 022861/0678
Assignment of Assignor's Interest
Recorded: 2009-06-23
Pages: 2
Assignor
HASHIMOTO, KOICHI
Executed: 2009-06-15
Assignee
NIPPON ELECTRIC GLASS CO., LTD.
7-1, SEIRAN 2-CHOME, OTSU-SHI, SHIGA, 520-8639, JAPAN
Covered Property
(1)
Semiconductor Encapsulation Material and Method for Encapsulating Semiconductor Using the Same