Patent Assignment
Reel/Frame 022865/0581
Assignment of Assignor's Interest
Recorded: 2009-06-23
Pages: 4
Assignors
SHEN, CHI-CHIH
Executed: 2009-06-18
CHEN, JEN-CHUAN
Executed: 2009-06-18
WANG, WEI-CHUNG
Executed: 2009-06-18
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26, CHIN 3RD. RD., 811, NANTZE, EXPORT PROCESSING ZONE, KAOHSIUNG, R.O.C., TAIWAN
Covered Property
(1)
Circuit Substrate and Method of Fabricating the Same and Chip Package Structure