Patent Assignment
Reel/Frame 022868/0913
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2009-06-25
Received: 2009-06-25
Pages: 17
Assignor
TOUCHDOWN TECHNOLOGIES, INC.
Executed: 2009-06-15
Assignee
LAKE ACQUISITION, INC.
650 PAGE MILL ROAD, PALO ALTO, CA, 94304, UNITED STATES
Covered Applications
(34)
Microelectronic Wafer Contactor Assembly and Method of Forming the Same
App. No. 61/153,731
→
PROBE CARD SUBSTRATE WITH BONDED VIA
App. No. 12/077,627
→
PROBE FOR TESTING SEMICONDUCTOR DEVICES WITH FEATURES THAT INCREASE STRESS TOLERANCE
App. No. 12/042,295
→
PLANARIZING PROBE CARD
App. No. 11/953,204
→
LATERAL INTERPOSER CONTACT DESIGN AND PROBE CARD ASSEMBLY
PCTPCTUS2007024631
→
PROBE CARD ASSEMBLY AND METHOD OF FORMING SAME
App. No. 11/986,453
→
TORSION SPRING PROBE CONTACTOR DESIGN
App. No. 11/983,521
→
METHOD OF FORMING PROBE CARD ASSEMBLY
App. No. 11/901,014
→
FORKED PROBE FOR TESTING SEMICONDUCTOR DEVICES
App. No. 11/855,094
→
METHOD FOR REPARING A MICROELECTROMECHANICAL SYSTEM
App. No. 11/778,207
→
SEMICODUCTOR TESTING DEVICE WITH ELASTOMER INTERPOSER
App. No. 11/754,818
→
POST AND TIP DESIGN FOR A PROBE CONTACT
App. No. 11/796,482
→
HYBRID PROBE FOR TESTING SEMICONDUCTOR DEVICES
App. No. 11/734,434
→
SYSTEM TO OPTIMIZE A SEMICONDUCTOR PROBE CARD
App. No. 11/686,768
→
PROBE HEAD WITH MACHINED MOUNTING PADS AND METHOD OF FORMING SAME
PCTPCTUS2007002131
→
PROBE HEAD WITH MACHINE MOUNTING PADS AND METHOD OF FORMING SAME
App. No. 11/641,255
→
Lateral interposer contact design and probe card assembly
App. No. 11/633,324
→
PROBE CARD ASSEMBLY
PCTPCTUS2006045870
→
EXCESS OVERDRIVE DETECTOR FOR PROBE CARDS
App. No. 11/535,219
→
LATERAL INTERPOSER CONTACT DESIGN AND PROBE CARD ASSEMBLY
PCTPCTUS2006035442
→
PROBE CARD WITH BALANCED LATERAL FORCE
App. No. 11/457,132
→
STACKED CONTACT BUMP
App. No. 11/421,064
→
OPTICALLY ENHANCED PROBE ALIGNMENT
App. No. 11/369,343
→
PROBE HEAD WITH MACHINED MOUNTING PADS AND METHOD OF FORMING SAME
App. No. 11/346,954
→
PROBE CARD ASSEMBLY
App. No. 11/317,408
→
TORSION SPRING PROBE CONTACTOR DESIGN
PCTPCTUS2005042135
→
PROCESS FOR FORMING MICROSTRUCTURES
PCTPCTUS2005041661
→
POST AND TIP DESIGN FOR A PROBE CONTACT
PCTPCTUS2005041665
→
Lateral interposer contact design and probe card assembly
App. No. 11/226,568
→
TORSION SPRING PROBE CONTACTOR DESIGN
App. No. 11/194,801
→
POST AND TIP DESIGN FOR A PROBE CONTACT
App. No. 11/194,720
→
PROCESS FOR FORMING MICROSTRUCTURES
App. No. 11/102,982
→
PROCESS FOR FORMING MEMS
App. No. 11/019,912
→
ANGLED FLYING LEAD WIRE BONDING PROCESS
App. No. 10/342,167
→