Patent Assignment
Reel/Frame 022879/0447
Assignment of Assignor's Interest
Recorded: 2009-06-16
Pages: 3
Assignor
KANEDA, YOSHIHARU
Executed: 2009-05-29
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Body to Be Plated, Method of Determining Plated Film Thickness, and Method of Manufacturing Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.