Patent Assignment
Reel/Frame 022886/0525
Assignment of Assignor's Interest
Recorded: 2009-06-29
Pages: 3
Assignee
TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC
19900 MACARTHUR BOULEVARD, SUITE 400, IRVINE, CALIFORNIA, 92612
Covered Property
(1)
Semiconductor Device on Direct Silicon Bonded Substrate with Different Layer Thickness
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.