Patent Assignment
Reel/Frame 022886/0900
Assignment of Assignor's Interest
Recorded: 2009-06-29
Pages: 6
Assignors
JADHAV, VIRENDRA R.
Executed: 2009-06-05
SIKKA, KAMAL K.
Executed: 2009-06-12
ZHENG, JIANTAO
Executed: 2009-06-02
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Semiconductor Device Assembly Having a Stress-Relieving Buffer Layer