Patent Assignment
Reel/Frame 022892/0454
Assignment of Assignor's Interest
Recorded: 2009-07-01
Pages: 3
Assignors
MIYAKI, YOSHINORI
Executed: 1999-10-18
SUZUKI, HIROMICHI
Executed: 1999-10-18
SUZUKI, KAZUNARI
Executed: 1999-10-18
NISHITA, TAKAFUMI
Executed: 1999-10-18
ITO, FUJIO
Executed: 1999-10-18
TSUBOSAKI, KUNIHIRO
Executed: 1999-10-18
KAMEOKA, AKIHIKO
Executed: 1999-10-18
NISHI, KUNIHIKO
Executed: 1999-10-18
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KY, TOKYO 101-8010, JAPAN
HITACHI ULSI SYSTEMS CO., LTD.
22-1, JOSUIHONCHO 5-CHOME, KODAIRA-SHI, TOKYO 187-0022, JAPAN
Covered Properties
(2)
Semiconductor Device Sealed with Resin Body
Application:
09/381,400 →
Manufacturing Method of a Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014570/0380 →
Merger and Change of Name
Sep 9, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024964/0180 →
Assignment of Assignor's Interest
May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →