Patent Assignment
Reel/Frame 022942/0337
Assignment of Assignor's Interest
Recorded: 2009-07-10
Pages: 5
Assignors
WANG, DAVID WEI
Executed: 2009-07-06
LIU, AN-HONG
Executed: 2009-07-02
TSAI, HAO-YIN
Executed: 2009-07-02
HUANG, HSIANG-MING
Executed: 2009-07-03
LEE, YI-CHANG
Executed: 2009-07-02
HO, SHU-CHING
Executed: 2009-07-02
Assignee
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D RD. 1, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.