IP Library › Assignment 029072/0590
Patent Assignment
Reel/Frame 029072/0590

Assignment of Assignor's Interest

Recorded: 2012-10-04 Pages: 4
Assignor
CHIPMOS TECHNOLOGIES INC.
Executed: 2012-09-26
Assignee
ZAWASHIRO DIGITAL INNOVATIONS LLC
1220 N. MARKET STREET, SUITE 804, WILMINGTON, DELAWARE, 19801
Covered Properties (2)
Semiconductor Package Structure and Method for Manufacturing the Same
Patent: 7,973,310 →
Application: 12/501,100 →
Publication: US 2010/0007001
Package Strucutre of an Integrated Circuit Chip Stack and Method Thereof
Application: 61/079,900 →
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 10, 2009
From: WANG, DAVID WEI; LIU, AN-HONG; TSAI, HAO-YIN; HUANG, HSIANG-MING
To: CHIPMOS TECHNOLOGIES INC.
Reel/Frame 022942/0337 →
Assignment of Assignor's Interest May 31, 2026
From: INTELLECTUAL VENTURES ASSETS 202 LLC
To: E2E SYSTEMS LLC
Reel/Frame 075531/0978 →