Patent Assignment
Reel/Frame 022962/0563
Assignment of Assignor's Interest
Recorded: 2009-07-16
Pages: 4
Assignors
YOSHIZAKI, KAZUYUKI
Executed: 2009-04-17
ITO, TEPPEI
Executed: 2009-04-17
ONOZUKA, IJI
Executed: 2009-04-17
NAKAMURA, KENSUKE
Executed: 2009-04-17
Assignee
SUMITOMO BAKELITE CO., LTD.
5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU, TOKYO, 1400002, JAPAN
Covered Property
(1)
Laminated Body, Circuit Board Including Laminated Body, Semiconductor Package and Process for Manufacturing Laminated Body