IP Library › Assignment 022970/0089
Patent Assignment
Reel/Frame 022970/0089

Assignment of Assignor's Interest

Recorded: 2009-07-08 Pages: 3
Assignors
KOIKE, OSAMU
Executed: 2009-07-02
KADOGAWA, YUTAKA
Executed: 2009-07-02
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property (1)
Semiconductor device having a dummy portion, method for manufacturing the semiconductor device, method for manufacturing a semiconductor package having the semiconductor device
Patent: 9,892,968 →
Application: 12/458,324 →
Publication: US 2010/0007030
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Assignment of Assignor's Interest Apr 11, 2022
From: LAPIS SEMICONDUCTOR CO., LTD.
To: ACHLYS TECHNOLOGIES INC.
Reel/Frame 059559/0280 →
Assignment of Assignor's Interest Jun 19, 2022
From: ACHLYS TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060244/0398 →