Patent Assignment
Reel/Frame 022989/0427
Assignment of Assignor's Interest
Recorded: 2009-07-22
Pages: 11
Assignors
CHEN, KUANG-HSIUNG
Executed: 2009-07-22
SHEN, CHI-CHIH
Executed: 2009-07-22
CHEN, JEN-CHUAN
Executed: 2009-07-22
CHANG, WEN-HSIUNG
Executed: 2009-07-22
CHANG, HUI-SHAN
Executed: 2009-07-22
HSU, PEI-YU
Executed: 2009-07-22
WU, FA-HAO
Executed: 2009-07-22
CHIA, CHEN-YU
Executed: 2009-07-22
CHU, CHI-CHIH
Executed: 2009-07-20
WENG, CHENG-YI
Executed: 2009-07-20
HSU, YA-WEN
Executed: 2009-07-20
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, KAOSIUNG, TAIWAN
Covered Property
(1)
Stackable Semiconductor Device Packages Including Openings Partially Exposing Connecting Elements, Conductive Bumps, or Conductive Conductors