IP Library › Assignment 022991/0150
Patent Assignment
Reel/Frame 022991/0150

Corrective Assignment to Correct the the Execution Date of Hsu, Wei-Yung, Inventor, to 05/18/2009 Previously Recorded on Reel 022923 Frame 0029. Assignor(S) Hereby Confirms the Assignor: Hsu, Wei-Yung Doc Date: 06/10/2009.

Recorded: 2009-07-22 Pages: 8
Assignors
MANENS, ANTOINE P.
Executed: 2009-05-18
HSU, WEI-YUNG
Executed: 2009-05-18
M'SAAD, HICHEM
Executed: 2009-06-10
Assignee
APPLIED MATERIALS, INC.
P.O. BOX 450A, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Cmp Pad Thickness and Profile Monitoring System
Patent: 8,043,870 →
Application: 12/437,897 →
Publication: US 2009/0280580
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 7, 2009
From: MANENS, ANTOINE P.; HSU, WEI-YUNG; M'SAAD, HICHEM
To: APPLIED MATERIALS, INC.
Reel/Frame 022923/0029 →