Patent Assignment
Reel/Frame 022995/0159
Assignment of Assignor's Interest
Recorded: 2009-07-23
Pages: 6
Assignors
PARK, JAE EON
Executed: 2009-04-07
KWAK, JUN KEUN
Executed: 2009-04-07
CHOI, JIN WOO
Executed: 2009-04-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Electrical Interconnects Using Thin Electrically Insulating Liners in Contact Holes
Application:
12/507,887 →
Publication:
US 2010/0029072
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 23, 2009
From: FANG, SUNFEI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 022995/0199 →
Employee Patent and Secrecy Agreement/Employee Reaffirmation Statement Upon Separation
Nov 24, 2009
From: YAN, JIANG
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 023563/0957 →
Assignment of Assignor's Interest
Feb 18, 2010
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 023953/0099 →