Patent Assignment
Reel/Frame 023007/0846
Assignment of Assignor's Interest
Recorded: 2009-07-27
Pages: 3
Assignee
THE FURUKAWA ELECTRIC CO., LTD
2-3 MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8322, JAPAN
Covered Property
(1)
Semiconductor Device, Wafer Structure and Method for Fabricating Semiconductor Device