IP Library › Assignment 023028/0561
Patent Assignment
Reel/Frame 023028/0561

Assignment of Assignor's Interest

Recorded: 2009-07-30 Pages: 2
Assignor
AUS DEM SPRING, HEIKO
Executed: 2009-07-17
Assignee
SILTRONIC AG
HANNS-SEIDEL-PLATZ 4, MUNCHEN, 81737, GERMANY
Covered Property (1)
Method for the Simultaneous Double-Side Grinding of a Plurality of Semiconductor Wafers
Patent: 7,815,489 →
Application: 11/774,675 →
Publication: US 2008/0014839
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 9, 2007
From: PIETSCH, GEORG; KERSTAN, MICHAEL
To: SILTRONIC AG
Reel/Frame 019528/0121 →
Assignment of Assignor's Interest Aug 4, 2009
From: SILTRONIC AG
To: PETER WOLTERS GMBH
Reel/Frame 023048/0857 →
Assignment of Assignor's Interest Jan 12, 2022
From: SILTRONIC AG
To: LAPMASTER WOLTERS GMBH
Reel/Frame 058628/0135 →
Change of Name Mar 23, 2022
From: PETER WOLTERS GMBH
To: LAPMASTER WOLTERS GMBH
Reel/Frame 060222/0639 →