Patent Assignment
Reel/Frame 023057/0614
Assignment of Assignor's Interest
Recorded: 2009-08-05
Pages: 3
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Particle Adhesion Preventing Method