Patent Assignment
Reel/Frame 023063/0098
Assignment of Assignor's Interest
Recorded: 2009-08-06
Pages: 11
Assignors
RYU, JEONG DO
Executed: 2009-08-04
CHOI, SI YOUNG
Executed: 2009-08-04
SHIN, YU GYUN
Executed: 2009-08-04
PARK, TAI SU
Executed: 2009-08-04
KIM, DONG CHAN
Executed: 2009-08-04
YOO, JONG RYEOL
Executed: 2009-08-04
JEONG, SEONG HOON
Executed: 2009-08-04
KANG, JONG HOON
Executed: 2009-08-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Integrated Circuit Devices Having Electrically Conductive Layers Therein with Partially Nitridated Sidewalls