Assignment of Assignor's Interest

Recorded: 2009-08-14 Pages: 2

Assignor

OGAWA, KENTA

Executed: 2009-08-04

Assignee

NEC CORPORATION

7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Method of Manufacturing Electronic Components Having Bump

Application: 12/541,340 →

Publication: US 2010/0044416

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.