Patent Assignment
Reel/Frame 025193/0156
Change of Name
Recorded: 2010-10-26
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Process for Manufacturing Semiconductor Device
Application:
12/491,436 →
Publication:
US 2009/0325104
Receiver and Method of Reducing Operating Current Thereof
Application:
12/491,604 →
Publication:
US 2009/0325525
Cache Memory Device
Application:
12/493,636 →
Publication:
US 2010/0011170
Solid State Imaging Device
Application:
12/496,050 →
Publication:
US 2010/0013967
Semiconductor Memory Device
Semiconductor Device and Method of Manufacturing the Same
Application:
12/497,051 →
Publication:
US 2010/0006929
Analog-To-Digital Converter with a Calibration Function
Method for Manufacturing Semiconductor Device
Patent:
8,114,766 →
Application:
12/498,664 →
Semiconductor Device
Semiconductor Device
Application:
12/499,813 →
Publication:
US 2010/0025760
Wireless Communication System and Wireless Communication Method
Application:
12/499,815 →
Publication:
US 2010/0027514
Pll Circuit, Communication Device, and Loopback Test Method of Communication Device
Semiconductor Memory with Sense Amplifier and Driver Transistor Rows
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Integrated Circuit
Application:
12/502,335 →
Publication:
US 2010/0026258
Semiconductor Integrated Circuit
Dynamic Type Semiconductor Memory Device and Operation Method of the Same
Method for Manufacturing a Semiconductor Device
Manufacturing Method of Semiconductor Device Having Self-Aligned Contact Connected to Silicide Layer on Substrate Surface
Communication Apparatus
Semiconductor Module Having an Interconnection Structure
Application:
12/505,011 →
Publication:
US 2009/0273092
Liquid Crystal Display and Drive Circuit Thereof
Oscillation Circuit
Application:
12/511,616 →
Publication:
US 2010/0033260
Semiconductor Memory Device and Semiconductor Device
Application:
12/518,148 →
Publication:
US 2010/0044775
Electrode Structure, Semiconductor Element, and Methods of Manufacturing the Same
Semiconductor Device Including an Lsi Chip and a Method for Manufacturing the Same
Inductor
Dielectric, Capacitor Using Dielectric, Semiconductor Device Using Dielectric, and Manufacturing Method of Dielectric
System, Method and Program for Determining Worst Condition of Circuit Operation
Application:
12/527,862 →
Publication:
US 2010/0076741
Semiconductor Device
Application:
12/529,879 →
Publication:
US 2010/0019325
Impulse Immunity Test Apparatus
Semiconductor Device
Mask Cleaning Apparatus and Mask Cleaning Method
Application:
12/538,442 →
Publication:
US 2010/0043656
Method of Manufacturing Semiconductor Device in Which Functional Portion of Element Is Exposed
Method of Manufacturing Electronic Components Having Bump
Application:
12/541,340 →
Publication:
US 2010/0044416
Semiconductor Device
Application:
12/542,139 →
Publication:
US 2010/0044786
Method of Manufacturing Semiconductor Device
Semiconductor Memory Device
Semiconductor Device and Method of Manufacturing Semiconductor Device
Application:
12/548,460 →
Publication:
US 2010/0123249
Method of Manufacturing Semiconductor Device
Semiconductor Device Having Stacked Ingap and Gaas Layers, and Method of Making Same
Delta Sigma Analog-to-Digital Converter
Method for Manufacturing Semiconductor Device and Molded Structure
Patent:
8,242,616 →
Application:
12/550,900 →
Semiconductor Integrated Circuit and Method of Leveling Switching Noise Thereof
Application:
12/552,947 →
Publication:
US 2010/0052765
Method of Making an Electronic Device and Electronic Device Substrate
Voltage/Current Conversion Circuit
Semiconductor Device Having Insulating Film with Surface Modification Layer and Method for Manufacturing the Same
Semiconductor Device Having an Interconnect Structure and a Reinforcing Insulating Film
Method of Manufacturing Semiconductor Device
Application:
12/561,003 →
Publication:
US 2010/0068853
Vapor Phase Deposition Apparatus, Method for Depositing Thin Film and Method for Manufacturing Semiconductor Device
Sense Amplifier and Semiconductor Memory Device Having Sense Amplifier
Circuit Board and Semiconductor Device
Statistical Spice Model Parameter Calculation Method, and Statistical Spice Model Parameter Calculation Device and Program
Application:
12/564,932 →
Publication:
US 2010/0076736
Ulsi Wiring and Method of Manufacturing the Same
Frame Processing Circuit
Application:
12/567,176 →
Publication:
US 2010/0079251
Semiconductor Device
Behavioral Synthesis Apparatus, Behavioral Synthesis Method, and Computer Readable Recording Medium
Method of lead cutting of a Flat Package device for proper soldering by half blanking method
Application:
12/569,085 →
Publication:
US 2010/0078803
Memory Interface and Operation Method of It
Semiconductor Device and Method of Manufacturing the Same
Application:
12/569,936 →
Publication:
US 2010/0078820
Delay Circuit
Data Communication Device, Air Pressure Monitoring System Using Thereof, and Data Communication Method
Semiconductor Device
Semiconductor Integrated Circuit and Control Method of the Same
Application:
12/575,118 →
Publication:
US 2010/0109720
Semiconductor Device and Method of Operating Thereof
Power Supply Circuit for Charge Pump Circuit
Method of Manufacturing Semiconductor Device
Application:
12/579,137 →
Publication:
US 2010/0120241
Electronic Device and Process for Manufacturing Electronic Device
Application:
12/580,388 →
Publication:
US 2010/0096717
Analog-To-Digital Converter
Pick-up apparatus for semiconductor chips and pick-up method for semiconductor chips using the same
Application:
12/585,004 →
Publication:
US 2010/0038031
Semiconductor Device
Method for Generating Layout Pattern of Semiconductor Device and Layout Pattern Generating Apparatus
Semiconductor Device Design Support Apparatus and Substrate Netlist Generation Method
Test Circuit and Test Method
Application:
12/585,116 →
Publication:
US 2010/0060323
System and Method for Supporting Layout Design of Semiconductor Integrated Circuit
Semiconductor integrated circuit, layout design method of semiconductor integrated circuit, and layout program product for same
Application:
12/585,183 →
Publication:
US 2010/0001763
Semiconductor Integrated Circuit Device and Test Terminal Arrangement Method
Clock supply device
Application:
12/585,337 →
Publication:
US 2010/0070793
Liquid crystal display device and flicker prevention method for a liquid crystal display device
Application:
12/585,338 →
Publication:
US 2010/0085288
Semiconductor integrated circuit design method for determining thickness of wiring based on plural factors contributing to thickness of wiring
Application:
12/585,339 →
Publication:
US 2010/0076580
Synchronization Detection Circuit, Pulse Width Modulation Circuit Using the Same, and Synchronization Detection Method
Method of Manufacturing Semiconductor Device Having Plural Transistors Formed in Well Region and Semiconductor Device
Digital-Analog Conversion Circuit and Output Data Correction Method of the Same
Vertical Power Mosfet Semiconductor Apparatus Having Separate Base Regions and Manufacturing Method Thereof
Verification device, verifying apparatus and verification system
Application:
12/585,388 →
Publication:
US 2010/0070260
Data Line Driving Circuit for Liquid Crystal Display Device and Method for Controlling the Same
Semiconductor chip and semiconductor wafer
Application:
12/585,393 →
Publication:
US 2010/0072578
Serial Data Transfer Apparatus
Display driving circuit and test method
Application:
12/585,438 →
Publication:
US 2010/0091009
Source driver circuit having bias circuit which produces bias current based on vertical synchronizing signal and method of controlling the same
Application:
12/585,439 →
Publication:
US 2010/0079437
Display Panel Drive Apparatus and Display Panel Drive Method
Layout verification apparatus, layout apparatus, layout verification method, layout verification program, and wiring forming method
Application:
12/585,441 →
Publication:
US 2010/0115765
Related Assignments
(21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 25, 2009
From: HAYASHI, FUMIAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022874/0563 →
Assignment of Assignor's Interest
Jun 25, 2009
From: MARUYAMA, TATSUHIKO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022876/0488 →
Assignment of Assignor's Interest
Jun 29, 2009
From: MURAYAMA, TOHRU; MIWA, HIDEYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022887/0596 →
Assignment of Assignor's Interest
Jul 2, 2009
From: HIRABAYASHI, SEIJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022908/0480 →
Assignment of Assignor's Interest
Jul 2, 2009
From: ANDOU, TAKAYOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022908/0828 →
Assignment of Assignor's Interest
Jul 7, 2009
From: SOEJIMA, KOJI; KURITA, YOICHIRO; KAWANO, MASAYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022921/0785 →
Assignment of Assignor's Interest
Jul 7, 2009
From: KAWASHIMA, YOSHIYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022922/0331 →
Assignment of Assignor's Interest
Jul 8, 2009
From: NAKAJIMA, YUJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022927/0044 →
Assignment of Assignor's Interest
Jul 9, 2009
From: KAWASHIMA, YOSHIYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022931/0943 →
Assignment of Assignor's Interest
Jul 9, 2009
From: HIGASHIDE, TOMOFUMI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022931/0965 →
Assignment of Assignor's Interest
Jul 9, 2009
From: OGASAWARA, KAZUO; NAKADAIRA, MASAO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022934/0448 →
Assignment of Assignor's Interest
Jul 13, 2009
From: TAKAHASHI, HIROYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022946/0127 →
Assignment of Assignor's Interest
Jul 13, 2009
From: OHKUBO, HIROAKI; NAKASHIBA, YASUTAKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022946/0643 →
Assignment of Assignor's Interest
Jul 14, 2009
From: SATOU, MIYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022950/0850 →
Assignment of Assignor's Interest
Jul 14, 2009
From: SHIMOGAWA, KENJYU; FURUTA, HIROSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022952/0270 →
Assignment of Assignor's Interest
Jul 15, 2009
From: NINOMIYA, HITOSHI; MIURA, YOSHINAO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022958/0206 →
Assignment of Assignor's Interest
Jul 15, 2009
From: MORITOKI, MASASHIGE
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022959/0306 →
Assignment of Assignor's Interest
Jul 17, 2009
From: KONISHI, SHINYA; ARAI, NORIO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 022970/0189 →
Assignment of Assignor's Interest
Aug 4, 2009
From: TANAKA, MAKOTO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 023047/0928 →
Assignment of Assignor's Interest
Aug 4, 2009
From: YANO, NOBUMITSU; TANABE, SHOGO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 023049/0585 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →