IP Library Assignment 022959/0306
Patent Assignment
Reel/Frame 022959/0306

Assignment of Assignor's Interest

Recorded: 2009-07-15 Pages: 2
Assignor
MORITOKI, MASASHIGE
Executed: 2009-07-06
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Manufacturing Method of Semiconductor Device Having Self-Aligned Contact Connected to Silicide Layer on Substrate Surface
Patent: 8,143,152 →
Application: 12/503,464 →
Publication: US 2010/0015789
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025193/0156 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →