Pick-up apparatus for semiconductor chips and pick-up method for semiconductor chips using the same
Even in the case of a thin semiconductor chip, the semiconductor chip is delaminated from an adhesive sheet so as to prevent cracking. A pick-up apparatus 1 has a stage 100 on which a dicing sheet 13 is placed, a slider which comes into contact with a back surface of the dicing sheet 13 and moves horizontally, in plan view, with respect to a semiconductor chip 12 , a slider housing portion which is formed in the stage 100 and houses the slider, and a suction mechanism 500 which is coupled to the stage 100 and suctions the slider housing portion. On the stage 100 , the dicing sheet 13 is placed in a position where the semiconductor chip 12 is opposed to the slider housing portion. The slider is provided with a plurality of slits on a side where the slider comes into contact with the dicing sheet 13 . The slit is in communication with the slider housing portion 102.
1 . A pick-up apparatus for a semiconductor chip which delaminates a semiconductor chip mounted on one surface of an adhesive sheet from the adhesive sheet, comprising:
a stage on which the adhesive sheet is placed;
a slider which comes into contact with the other surface of the adhesive sheet and moves horizontally, in plan view, with respect to the semiconductor chip;
a slider housing portion which is formed in the stage and houses the slider; and
a suction mechanism which is coupled to the stage and suctions the slider housing portion,
wherein on the stage, the adhesive sheet is placed in a position where the semiconductor chip is opposed to the slider housing portion,
the slider is provided with a slit on a side where the slider comes into contact with the adhesive sheet, and
the slit is in communication with the slider housing portion.
2 . The pick-up apparatus for a semiconductor chip according to claim 1 , wherein the slit extends at right angles, in plan view, to the moving direction of the slider.
3 . The pick-up apparatus for a semiconductor chip according to claim 1 , wherein opposite to one of the semiconductor chips, a plurality of the sliders are arranged parallelly in a manner spaced from each other and the plurality of sliders move individually.
4 . A pick-up method for a semiconductor chip which delaminates a semiconductor chip mounted on one surface of an adhesive sheet from the one surface of the adhesive sheet by using a pick-up apparatus,
the pick-up apparatus comprising:
a stage on which the adhesive sheet is placed;
at least one or more sliders which come into contact with the other surface of the adhesive sheet and move horizontally, in plan view, with respect to the semiconductor chip;
a slider housing portion which is formed in the stage and houses the slider;
a suction mechanism which is coupled to the stage and suctions the slider housing portion; and
at least one or more slits which are provided on a side where the slider comes into contact with the adhesive sheet, and are in communication with the slider housing portion,
the pick-up method comprising:
placing the adhesive sheet on the stage from a back surface in a position where the slider housing portion is opposed to the semiconductor chip, and bringing the adhesive sheet into contact with the slider;
suctioning the slider housing portion; and
moving the slider horizontally, in plan view, with respect to the semiconductor chip.
5 . The pick-up method for a semiconductor chip according to claim 4 , wherein in the step of bringing the adhesive sheet into contact with the slider, the adhesive sheet is arranged in a position where a peripheral edge part of the semiconductor chip and a peripheral edge part of the slider housing portion are opposed to each other.