Patent Assignment
Reel/Frame 023125/0980
Assignment of Assignor's Interest
Recorded: 2009-08-14
Pages: 3
Assignor
OKAFUJI, YOSHITSUGU
Executed: 2009-08-11
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Wire bonding device and wire bonding process using same
Application:
12/461,552 →
Publication:
US 2010/0051670
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.