Patent Assignment
Reel/Frame 023126/0462
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2009-08-20
Received: 2009-08-20
Pages: 5
Assignors
CHI, HEEJO
Executed: 2009-08-07
CHO, NAMJU
Executed: 2009-08-07
SHIN, HANGIL
Executed: 2009-08-07
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Applications
(3)
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A TIERED SUBSTRATE PACKAGE AND METHOD OF MANUFACTURE THEREOF
App. No. 12/538,098
→
SENSING THE TENDON TENSION THROUGH THE CONDUIT REACTION FORCES
App. No. 12/269,552
→
Internal Combustion Engine with an Improved Charging Action in the Combustion Chamber
App. No. 12/158,688
→