IP Library › Granted Patent US 7,863,735
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US 7,863,735 · Confirmation No. 6707

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A TIERED SUBSTRATE PACKAGE AND METHOD OF MANUFACTURE THEREOF

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2009-08-07 SPEC Specification 24 View
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Quick Facts
Patent No.
US 7,863,735
App. No.
12/538,098
Filed
2009-08-07
Granted
2011-01-04
Art Unit
2822
PTA
0 days