Patent Assignment
Reel/Frame 023144/0415
Assignment of Assignor's Interest
Recorded: 2009-08-25
Pages: 4
Assignors
KANG, JOON SEOK
Executed: 2009-07-21
KWEON, YOUNG DO
Executed: 2009-07-21
KIM, HONG WON
Executed: 2009-07-21
YUAN, JINGLI
Executed: 2009-07-21
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Die Package Including Encapsulated Die and Method of Manufacturing the Same