Patent Assignment
Reel/Frame 023145/0297
Assignment of Assignor's Interest
Recorded: 2009-08-26
Pages: 5
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, PATENT DEPARTMENT, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Semiconductor Wafer-to-Wafer Bonding for Dissimilar Semiconductor Dies and/or Wafers