Patent Assignment
Reel/Frame 023165/0427
Assignment of Assignor's Interest
Recorded: 2009-08-28
Pages: 4
Assignors
HSIEH, HARRY W.
Executed: 2007-02-16
ALLAM, DOMINIC J.
Executed: 2007-02-16
WU, ZIYAN
Executed: 2007-02-16
Assignee
DOW GLOBAL TECHNOLOGIES INC.
WASHINGTON STREET, 1790 BUILDING, MIDLAND, MICHIGAN, 48674
Covered Property
(1)
System for Bonding Glass into a Structure
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 7, 2017
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 042723/0109 →
Assignment of Assignor's Interest
Sep 10, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 069923/0030 →
Change of Legal Entity
Sep 10, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068907/0881 →
Assignment of Assignor's Interest
Sep 10, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068922/0001 →