IP Library › Assignment 023179/0555
Patent Assignment
Reel/Frame 023179/0555

Assignment of Assignor's Interest

Recorded: 2009-09-01 Pages: 4
Assignors
WANG, YI-XIANG
Executed: 2009-08-18
DOU, JUYING
Executed: 2009-08-17
KANAI, KENICHI
Executed: 2009-08-18
Assignee
HERMES MICROVISION, INC.
5F, NO. 18, CREATION ROAD 1, SCIENCE PARK, HSIN-CHU, 300, TAIWAN
Covered Property (1)
Wafer Grounding and Biasing Method, Apparatus, and Application
Patent: 8,908,348 →
Application: 12/552,270 →
Publication: US 2011/0051306
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
Assignment of Assignor's Interest Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →