Patent Assignment
Reel/Frame 023186/0345
Assignment of Assignor's Interest
Recorded: 2009-09-02
Pages: 3
Assignor
KUAN, CHIYAN
Executed: 2009-08-31
Assignee
HERMES MICROVISION, INC.
5F, NO. 18, CREATION ROAD 1, SCIENCE PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Substrate and Die Defect Inspection Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.