Assignment of Assignor's Interest

Recorded: 2009-09-09 Pages: 2

Assignor

WAKISAKA, SHINJI

Executed: 2009-09-03

Assignee

CASIO COMPUTER CO., LTD.

6-2, HON-MACHI, 1-CHOME, SHIBUYA-KU,, TOKYO, 151-8543, JAPAN

Covered Property (1)

Semiconductor Device Having an Interlayer Insulating Film Wiring Laminated Structure Section and Method of Fabricating the Same

Application: 12/555,997 →

Publication: US 2010/0059895

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.