Patent Assignment
Reel/Frame 027145/0373
Assignment of Assignor's Interest
Recorded: 2011-10-31
Pages: 4
Assignor
CASIO COMPUTER CO., LTD.
Executed: 2011-10-28
Assignee
TERAMIKROS, INC.
10-6, IMAI 3-CHOME, OME-SHI,, TOKYO,, 198-8555, JAPAN
Covered Properties
(5)
Optical Sensor Module with Semiconductor Device for Drive
Semiconductor Device Including Wiring and Manufacturing Method Thereof
Method of Forming Wiring on a Plurality of Semiconductor Devices from a Single Metal Plate, and a Semiconductor Construction Assembly Formed by the Method
Semiconductor Device Capable of Suppressing Warping in a Wafer State and Manufacturing Method Thereof
Semiconductor Device Having an Interlayer Insulating Film Wiring Laminated Structure Section and Method of Fabricating the Same
Application:
12/555,997 →
Publication:
US 2010/0059895
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 11, 2005
From: MIHARA, ICHIRO; JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 016091/0409 →
Assignment of Assignor's Interest
Jan 23, 2009
From: JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 022147/0819 →
Assignment of Assignor's Interest
Jul 21, 2009
From: MIHARA, ICHIRO; WAKABAYASHI, TAKESHI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 022982/0984 →
Assignment of Assignor's Interest
Jul 22, 2009
From: SHIOTA, JUNJI; KOROKU, TAISUKE; FUJII, NOBUMITSU; KUWABARA, OSAMU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 022988/0447 →
Assignment of Assignor's Interest
Sep 9, 2009
From: WAKISAKA, SHINJI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 023205/0725 →
Assignment of Assignor's Interest
Jan 27, 2017
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 041521/0001 →
Merger
Jan 27, 2017
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 041664/0471 →