IP Library › Assignment 022982/0984
Patent Assignment
Reel/Frame 022982/0984

Assignment of Assignor's Interest

Recorded: 2009-07-21 Pages: 2
Assignors
MIHARA, ICHIRO
Executed: 2009-07-09
WAKABAYASHI, TAKESHI
Executed: 2009-07-10
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO, 151-8543, JAPAN
Covered Property (1)
Method of Forming Wiring on a Plurality of Semiconductor Devices from a Single Metal Plate, and a Semiconductor Construction Assembly Formed by the Method
Patent: 8,067,274 →
Application: 12/506,503 →
Publication: US 2010/0019383
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 31, 2011
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027145/0373 →
Assignment of Assignor's Interest Jan 27, 2017
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 041521/0001 →
Merger Jan 27, 2017
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 041664/0471 →