IP Library Assignment 023209/0228
Patent Assignment
Reel/Frame 023209/0228

Assignment of Assignor's Interest

Recorded: 2009-08-31 Pages: 3
Assignors
NISHINA, TSUTOMU
Executed: 2004-09-22
OKAMOTO, KENJI
Executed: 2004-09-22
Assignee
FUJI ELECTRIC HOLDINGS CO., LTD.
1-1 TANABESHINDEN, KAWASAKI-KU, KAWASAKI 210-0856, JAPAN
Covered Property (1)
Lead-Free Solder Composition Including Microcapsules
Patent: 8,206,515 →
Application: 12/461,982 →
Publication: US 2009/0320960
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Aug 26, 2011
From: FUJI ELECTRIC HOLDINGS CO., LTD.
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 026891/0655 →