Lead-free solder composition including microcapsules
View Patent ↗A lead-free, cream solder composition that is printable includes a SnZn alloy which is lead-free and which is a powder; a solder flux including an epoxy resin; microcapsules that are organic carboxylic acid particles encapsulated with a resin selected from a group consisting of epoxy, polyimide, polycarbonate, polyamide, polyester, polyurea, polyolefin, and polysulfone resins; and a solvent which is a glycol. The presence of the organic carboxylic acid encapsulated with a resin as microcapsules suppresses reactivity of zinc in the SnZn alloy with the organic carboxylic acid Alternately, the solder flux may include the epoxy resin; an organic carboxylic acid; and the solvent; and microcapsules that are particles of a SnZn alloy encapsulated with the described resin. The presence of the SnZn alloy encapsulated with a resin as microcapsules suppresses reactivity of zinc in the SnZn alloy with the organic carboxylic acid so that viscosity and solderability are stabilized.
1. A solder composition which is lead-free, which is a cream and is printable, and which has stabilized viscosity and solderability, comprising:
a metal powder consisting of a SnZn alloy; and
a solder flux consisting of:
an epoxy resin;
microcapsules consisting of particles of organic carboxylic acid encapsulated with a resin selected from a group consisting of epoxy, polyimide, polycarbonate, polyamide, polyester, polyurea, polyolefin, and polysulfone resins; and
a solvent which is a glycol,
wherein the presence of the organic carboxylic acid encapsulated with a resin as microcapsules suppresses reactivity of zinc in the SnZn alloy with the organic carboxylic acid so that viscosity and solderability are stabilized.
2. The solder composition according to claim 1 , wherein the epoxy resin is selected from the group consisting of bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, novolak-type epoxy resin, alicyclic epoxy resin, and their mixtures.
3. The solder composition according to claim 1 , wherein the organic carboxylic acid is selected from the group consisting of saturated aliphatic dicarboxylic acid, unsaturated aliphatic dicarboxylic acid, cycloaliphatic dicarboxylic acid, amino group-containing carboxylic acid, hydroxyl group-containing carboxylic acid, heterocyclic dicarboxylic acid, and their mixtures.
4. The solder composition according to claim 1 , wherein the organic carboxylic acid has a melting point ranging from 130 to 220° C.
5. The solder composition according to claim 1 , wherein the solder flux contains a combined content of-the epoxy resin and the organic carboxylic acid that ranges from 70 to 100% by mass based on mass of the solder flux, and content of the glycol ranges up to 30% by mass based on mass of the solder flux, and wherein the epoxy resin and the organic carboxylic acid are so formulated in the solder flux that the organic carboxylic acid ranges from 0.8 to 2.0 equivalents relative to 1.0 equivalent of the epoxy resin therein.
6. The solder composition according to claim 1 , wherein the organic carboxylic acid is selected from the group consisting of cyclohexene-dicarboxylic acid and dimethylglutaric acid.
7. The solder composition according to claim 1 , wherein the epoxy resin is selected from the group consisting of bisphenol F-type epoxy resin, novolak-type epoxy resin, alicyclic epoxy resin, and their mixtures.
8. A solder composition which is lead-free, which is a cream and is printable, and which has stabilized viscosity and solderability, comprising:
a solder flux consisting of:
an epoxy resin;
an organic carboxylic acid; and
a solvent which is a glycol; and
microcapsules comprising particles of a metal powder consisting of a SnZn alloy encapsulated with a resin selected from a group consisting of epoxy, polyimide, polycarbonate, polyamide, polyester, polyurea, polyolefin, and polysulfone resins,
wherein the presence of the SnZn alloy encapsulated with a resin as microcapsules suppresses reactivity of zinc in the SnZn alloy with the organic carboxylic acid so that viscosity and solderability of the solder composition are stabilized.
9. The solder composition according to claim 8 , wherein the epoxy resin is selected from the group consisting of bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, novolak-type epoxy resin, alicyclic epoxy resin, and their mixtures.
10. The solder composition according to claim 8 , wherein the organic carboxylic acid is selected from the group consisting of saturated aliphatic dicarboxylic acid, unsaturated aliphatic dicarboxylic acid, cycloaliphatic dicarboxylic acid, amino group-containing carboxylic acid, hydroxyl group-containing carboxylic acid, heterocyclic dicarboxylic acid, and their mixtures.
11. The solder composition according to claim 8 , wherein the organic carboxylic acid has a melting point ranging from 130 to 220° C.
12. The solder composition according to claim 8 , wherein the solder flux contains a combined content of the epoxy resin and the organic carboxylic acid that ranges from 70 to 100% by mass based on mass of the solder flux, and content of the glycol ranges up to 30% by mass based on mass of the solder flux, and wherein the epoxy resin and the organic carboxylic acid are so formulated in the solder flux that the organic carboxylic acid ranges from 0.8 to 2.0 equivalents relative to 1.0 equivalent of the epoxy resin therein.
13. The solder composition according to claim 8 , wherein the organic carboxylic acid is selected from the group consisting of cyclohexene-dicarboxylic acid and dimethylglutaric acid.
14. The solder composition according to claim 8 , wherein the epoxy resin is selected from the group consisting of bisphenol F-type epoxy resin, novolak-type epoxy resin, alicyclic epoxy resin, and their mixtures.