Patent Assignment
Reel/Frame 023224/0857
Assignment of Assignor's Interest
Recorded: 2009-09-14
Pages: 2
Assignor
USAMI, TATSUYA
Executed: 2006-02-14
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Having an Interconnect Structure and a Reinforcing Insulating Film
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.