Patent Assignment
Reel/Frame 023236/0070
Assignment of Assignor's Interest
Recorded: 2009-09-15
Pages: 10
Assignee
KUMAR, ANANDA
1999 BLACKFOOT DRIVE, FREMONT, CALIFORNIA, 94539
Covered Properties
(3)
Structures and Methods for Wafer Packages, and Probes
Methods for Forming Ceramic Substrates with Via Studs
Structures and Methods for Wafer Packages, and Probes
Application:
61/096,315 →